Dazi Li, Beijing University of Chemical Technology, China
Hua Qu, Xi'an Jiaotong University, China

William Yeoh, Deakin University, Australia
Jianhong Zhou, University Of Electronic Science And Technology Of China, China

Shuxing Guo, Central University of Finance and Economics, China
Ming Zhu, Shandong University of Technology, China
Eric Tsui, The Hong Kong Polytechnic University, Hong Kong, China 
Emanuel S. Grant, University of North Dakota, USA 

Yong Xie, Nanjing University Of Posts And Telecommunications, China
Jing Li, Shandong University of Technology, China
Li Liu, Nanchang University, China

Alice Wong, South Asia Institute of Science and Engineering, Hong Kong, China

Miao Yu, University of Lincoln, UK

Jian Sun, Shandong University of Technology, China
Bo Mei, Texas Christian University, USA
Loc Nguyen, Sunflower Soft Company, Vietnam
Zheng Chang, Shandong University of Technology, China

Huanjie Tao, Northwestern Polytechnical University, China
Yiping Liu, Hunan University, China
Adela Lau, The University of Hong Kong, Hong Kong, China

Akshara Makrariya, VIT Bhopal University , INDIA
Athakorn Kengpol, King Mongkut's University of Technology, Thailand
Changze Cui, Amazon Web Service, USA
ERGÜL Özgür, Gazi Üniversitesi, Türkiye
Firdhous M.F.M, University of Moratuwa, Sri Lanka
Jinghuey Khor, University of Southampton, UK
Loc Nguyen, Sunflower Soft Company, Vietnam
M. Bhanu Sridhar, GVPCEW, India
N. Sharmili, GVP College of Engineering for Women, India
Şahin Çağrı, Gazi Üniversitesi, Türkiye
Sanei Saeid, The University of Nottingham, UK
Stephanie Chua, Universiti Malaysia Sarawak, Malaysia
Todsanai Chumwatana, Rangsit University, Thailand
Yinpu Li, Florida State University, USA